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半导体产业政企合作相关法律要点之产业园篇

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作者:赵显龙 林嘉 唐震宇 陈俊文

伴随着美国《2022年芯片与科学法案》的正式签署生效,“半导体”、“集成电路”、“芯片”等词语再次成为国内外热议的话题。事实上,我国政府在本世纪初即已意识到半导体行业发展对于国民经济发展和国家信息安全的重要性,并相继出台了多项产业扶持政策。在各项政策的刺激下,多地政府在近几年亦兴起了一股空前的“造芯热”,并在当地纷纷上马相关产业园项目。然而,根据相关新闻报道可知,受限于半导体企业资金链断裂、产业园定位及规划不符合当地半导体产业发展实际等原因,已有部分项目出现了停摆、烂尾等情况。

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