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从中国半导体企业的关注点看美国《芯片法案》的影响和应对

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作者:刘新宇 郭欢 陈起超 蒋睿馨 刘学朋 刘姝倩 陈琳

2022年8月9日,美国总统拜登签署生效《2022年芯片和科学法案》(以下称“《芯片法案》”),以强化美国半导体产业供应链安全和维护国家安全为由,对美国本土的半导体制造和其他相关前沿领域的科研活动提供了巨额的财政拨款和投资税收抵免等产业优惠举措。同月25日,美国总统拜登签发了一项行政令,为《芯片法案》的落地实施设立了 “跨部门指导委员会”,并明确了实施《芯片法案》需优先考虑的事项以及与本其实施相关的平台网站设立事宜。

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